Services

Process flow for harvesting.

The components that get harvested undergo the process of reballing from an established service organization — audited and approved for retinning and reballing services by major defense OEMs, contract manufacturers, and franchised distributors.

Close-up of a BGA semiconductor package showing solder balls
Certifications & Standards

Reballed to the IEC 62647-4 technical standard.

Our reballing partner is certified to AS9100D and ISO 9001:2015 and provides a Certificate of Conformance to verify that reballing was performed per the IEC 62647-4 technical standard for ball grid array components, including full electrical and visual inspection.

  • AS9100D
  • ISO 9001:2015
  • IEC 62647-4
Pin Correlation Testing

Optional DLA-qualified electrical verification.

NewTech Components will get a basic electrical pin correlation test performed with a DLA-qualified lab to verify that the protection diodes in front of various pins are healthy and are not OPEN or SHORT. This test is optional and will result in additional cost and turnaround time to receive the components. Advanced functional testing is also available through trusted outsourced partners.

What We Offer

NewTech Components service rollout.

Start a project
01Service

Excess Inventory

Strategic monetization of surplus electronic components.

02Service

Consignment Programs

Flexible managed inventory placement with revenue share.

03Service

Custom Solutions

Bespoke sourcing and fulfillment tailored to your build.

04Service

Custom Harvesting Solutions

Targeted recovery of obsolete or hard-to-find chipsets.

05Service

Recycling / Asset Recovery

Responsible disposition of end-of-life electronic assets.

06Service

U.S. Based Data Centers

Functional decommissioning of data center hardware and PCBs.